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Signal Integrity Analysis

Early in the product hardware design cycle, the major concern is to reason out whether the engineering intent is being accomplished correctly and fully. Due to the apparent upturn in system-level signal integrity issues, it is feasibility study that evolves into a proved and fast time-to-market enabler when it comes to PCB layout and manufacturing projects. To help eliminate unnecessary PCB design iterations, preclude from the project delays or unexpected interconnect bottlenecks, and ensure a robust circuit design, Softeq gives its customers an expert hand in signal integrity simulation and analysis.

Now that we are struggling to master high-speed clock as the logic rise and fall times both gain switching speed (which is often appropriate of DDR2, DDR3, and DDR4 designs), the final layout verification proves to be the ideal troubleshooting tool. With a set of specialized tools at hand, the team executes thorough signal integrity testing that comprises signal integrity modeling, hurdling reflections and distortions, and averting crosstalk issues of high-speed interfaces, including DDR, LVDS, MIPI, SATA, PCIe, and more.

Softeq squad generates accurate SI reports that comprise a comprehensive set of recommendations on how to efficiently resolve the detected issues. Harnessing our verification techniques, you can extricate the following concerns:

  • Reflections
  • Overshoot and undershoot
  • Ringing
  • Crosstalks
  • Timing
  • Dielectric losses
  • Excessive EMI radiation
  • Simultaneous Switching Noise (SSN)
  • Jitter
  • Routing constraints
  • Rule exploration, definition and validation

Power Integrity Simulation and Analysis

With the dominance of high-density ICs featuring fine-pitch components and complicated stack-ups in modern electronics, challenges associated with excessive board voltage consumption and device-level power consumption become increasingly common. The impact of power delivery issues can be harmful enough to trigger significant signal integrity degradations, or even subject the PCB design to a total failure.

To restrain these unfavorable outcomes and achieve a clean and smoothly functioning power system, Softeq’s board designers take care to root out major power distribution challenges in the early stages of a project. Aiming to successfully bring your products up to the manufacturing stage, our team carries out advanced power integrity analysis that ensures power decoupling and distribution sustainability improvement along with reducing noise propagation through the system.

Scope for Power integrity analysis (AC and DC):

  • Calculation of accurate impedance profiles for decoupling
  • Validation of the power system network efficiency
  • AC noise analysis and resonant behavior at various frequencies and time points
  • Careful selection of components and placement locations
  • Power network islands and power split design and analysis
  • DC current hotspots detection
  • DC voltage drops prevention

PCB Thermal Modeling and Analysis

Now that the modern PCB design grows increasingly complex, footprints of electronic devices shrink due to a way higher component density on boards. In the face of the entire circuit design failure danger, power dissipation is referred to as one of the major concerns for PCB engineers. Amid heavily populated boards, single-component characteristics of the closely-spaced layout parts become invalid. Softeq’s engineers will get your printed circuit board through a comprehensive thermal analysis cycle to aid you in hurdling overheating-associated issues and optimizing the layout physical behavior, thus ensuring a worry-free selection of an enclosure for the tested board.

Given that thermal interaction encounters numerous obstacles, advanced cooling solutions are required to help balance the heat flow across the layout and scrupulously calculate the exact junction temperature for each circuit. Provided with the estimations, our engineering team will make sure to precisely position the hot components in cooler areas and arrange the air flow along with defining the required heatsinks’ size and number and measuring the fan spans. Relying on a set of highly-accurate tools that enable to avoid cumbersome manual calculations, our squad will investigate a full range of PCB physical properties and detect critical values:

  • Examine thermal conductivities and heat flux
  • Locate hotspots
  • Inspect bottlenecks or drills’ current heating power density
  • Identify overstressed components (e.g. junction overheat)

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